News
Register Now: Next-Generation HEMS: Secure Edge AI with Qualcomm Dragonwing™
We explore turnkey reference designs.
QUALCOMMArrange a Meeting: electronica 2026
Visit the CODICO booth – hall C3, booth 558. Experience the latest technologies from our suppliers.
CODICOArduino® VENTUNO™ Q: Dual-Brain Platform for Robotics
Arduino VENTUNO Q board combines powerful computing capabilities and precise control.
ARDUINOxPico 600 by LANTRONIX: Wi-Fi6, Bluetooth 5.4 and Ethernet
With the xPico 600, CODICO offers a compact connectivity solution for industrial and IoT devices.
LANTRONIXR41D: Y2 Film Capacitor for Demanding SiC Topologies
The YAGEO-KEMET R41D is specifically designed to handle dynamic stresses, caused by fast switching.
YAGEO-KEMETSAGAMI’s Litz Wire Inductors for Class-D Audio Amplifiers
SAGAMI's 7G23R series reduces AC losses in output filter inductors for Class-D amplifiers.
SAGAMIFloat27®: Reliable Board-to-Board Connections Despite Tolerances
The Float27® SMT connectors expand the One27® product family with a flexible floating solution.
EPTDB2605-AC for the Next Generation of EV Charging
DROPBEATS solution for equipping AC wallboxes to meet the requirements of ISO 15118-20.
DROPBEATSHIROSE FX36: Floating Board-to-Board Connectors for Automotive
FX36 series with a 0.5mm-pitch
HIROSESILVERTEL AG59800-ULP: Ultra-Slim PoE PD Module
With a height of just 10.5mm, the AG59800-ULP from SILVERTEL creates additional design freedom for compact PoE applications.
SILVERTELFVCH Al-Polymer Hybrid Capacitor: Ripple Current Capability
The FVCH series is based on the high-capacitance FVC series and offers improved ripple current capability.
SUNCON150A Switching Capacity in Just 863mm²: SANYOU SY508
With the SY508, SANYOU enables direct switching of currents up to 150A on the PCB.
SANYOUQualcomm-Based Wi-Fi Modules for Wireless Designs
METICOMM's Wi-Fi modules cover Wi-Fi4 to Wi-Fi7.
METICOMMAg401 from SILVERTEL: Combining PoE and USB-C
SILVERTEL introduces the Ag401, an innovative module that combines Power over Ethernet with USB-C Power Delivery.
SILVERTELPPAC Terminal Blocks: Transmission Through Panel Walls
The panel feed-through terminal blocks of the PPAC series are suitable for conductor cross-sections.
DINKLEGateMate A2: High-Performance FPGA with 40k CPEs
The GateMate A2 is a new FPGA featuring twice the logic resources of the GateMate A1.
COLOGNE CHIPMore Power in Less Space: CoolPower® HD from AMPHENOL
AMPHENOL CS expands its portfolio with the CoolPower® HD.
AMPHENOL CSCompact Leak Detection for Maximum System Reliability
NIDEC COMPONENTS EUROPE expands its portfolio with the WL10 Series.
NIDEC COMPONENTS EUROPEWaterproof Connections with Micro Connector TH381 UP
TECHNO expands its TEEPLUG® family with a compact inline micro connector.
TECHNOSENSEAIR S12 CO₂ Sensor: Compact NDIR Technology
With the new S12 CO₂ sensor, SENSEAIR is setting new standards in CO₂ measurement technology opening up new possibilities for building automation and smart home systems.
SENSEAIR